Kandou Introduces Interconnect Enabling Lower Cost Semiconductor Solutions18.12.2014 08:11
Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.
For the first time in history, the cost to manufacture a transistor in the most advanced silicon process has increased compared to the previous generation. As a result, system architects are looking for more cost effective ways to partition and package silicon devices for optimal performance. Integrating several chips into a shared package can be attractive, but only if the in-package communication between chips allows for extremely high bandwidth and very low power.
“Architectures that combine multiple chips into a single package are not new,” said Kandou Founder and CEO Amin Shokrollahi, “but increasing bandwidth and improving signal integrity while maintaining very low power in an affordable package is a daunting task. Glasswing delivers on the promise of 2.5D integration by providing a cost-effective solution that offers unprecendented, in-package, chip-to-chip bandwidth at very low power.”
Glasswing Architecture and Applications
The core of Kandou’s Glasswing technology is a chordal code that delivers five bits over six correlated wires within each clock cycle. Through a simple yet elegant comparator network, signals are received and translated into bits resulting in much higher overall link throughput.
To fully realize the benefits of the Glasswing architecture, Kandou has developed optimized circuits and architectures for all parts of the transmission chain.
Kandou’s Glasswing product development is underway for the first instantiation of the PHY optimized for in-package links between processor cores. A comprehensive 28nm PHY evaluation package will be available Q3 2015.
About Kandou Bus S.A.
Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the invention, design, license and implementation of unmatched chip-to-chip link solutions. Kandou’s Chord™ Signaling technology lowers the power consumption and improves the performance of semiconductors, unlocking new capabilities in electronic devices and systems.