Germany-based company acquires Swiss Photonfocus

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27.08.2019
Photonfocus' MV4 camera

Photonfocus AG, a specialist in machine vision technology has been acquired by ISRA Vision – a Germany based global leader in surface inspection of web materials – for a price in the high single-digit million range. Photonfocus and its 50 staff members will support ISRA in achieving its strategic goals.

Since the beginning of this year, 13 Swiss startups have been acquired by large organizations. Adding to these statistics, another Swiss company, Photonfocus, has been acquired. Founded in 2001 as a spin-off of the Swiss Center for Electronics and Microtechnology CSEM, Photonfocus develops high-speed HDR CMOS image sensors and cameras based on its patented LinLog® technology. The company offers a wide range of products from ultra-low-light CMOS sensors to highly dynamic HDR image sensors that cover wide application fields in machine vision and optical metrology. The products facilitate 3D inspection and measurement, spectroscopy, process monitoring and defect analysis, motion analysis and quality inspection.

After introducing multiple products in the market and growing its team to 50 employees, Photonfocus’ journey has come to an end. The Lachen (Schwyz) based company has been acquired by ISRA Vision, from Darmstadt Germany and one of the globally leading providers of machine vision programs, specializing in the area of 3D machine vision, in particular for “3D robot vision”. With the goal to expand into smart factory automation through embedded sensor technology, ISRA Vision acquired 100% shares in Photonfocus for the purchasing price that is slightly above the former’s annual turnover, which is in the high single-digit million range. The acquisition will be financed from the operational cash flow without medium-term debt.

ISRA vision will integrate Photonfocus to enable quick progress to be made on its demanding innovation roadmap. For almost two decades now, the company has been developing sensor chip designs for industrial image processing with high-speed demands based on a modular architecture. Current developments are aimed at the use of 3D technology for industrial applications and hyperspectral sensors.

(Press release/ran)

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