Vaud-based Kandou, an innovative leader in high-speed, high-quality signal conditioning solutions, announces the successful first close of its $100M equity financing round on August 24th, 2023. This significant milestone will facilitate the company's ambitious expansion into new markets, further solidifying its position as a leader in the semiconductor industry.
Kandou is a fabless semiconductor company that offers differentiated and fundamental interconnect technology. In addition to building semiconductors for advanced standards in USB and PCIe applications, Kandou silicon and IP solutions lower power consumption and improve the performance of wired connectivity. Kandou's groundbreaking chip to chip solutions have already transformed the way data is transmitted providing unparalleled efficiency and performance.
This new funding will enable Kandou to accelerate its global expansion efforts and to launch Regli, the multiprotocol retimer family member for PCI Express 5.0 specification and CXL 2.0. Regli improves the physical connection quality, ultra-low latency, and security for PCIe and CXL interfaces, making it an ideal solution for data centers and hyperscalers with heavy computational workloads. These centers employ PCIe technology and CXL as the primary interface to link host processors, GPUs, AI accelerators, CXL memory modules, and SSD storage. Other applications for Regli include servers, workstations, desktops, 5G infrastructure equipment, networking equipment, PCIe and CXL storage, and PCIe active cables.
"Kandou is thrilled to have received such overwhelming support from our investors," said Amin Shokrollahi, CEO & Founder. "This financing round is a testament to the value of our technology to innovate and deliver high-speed connectivity solutions. We are excited to leverage this funding to bring our solutions to more customers around the world."
A second close totaling $27.7M is planned for later this year.
(Press release / SK)
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